MSC8101VT1375F
| Parameters | |
|---|---|
| Mounting Type | Surface Mount |
| Package / Case | 332-BFBGA, FCBGA |
| Operating Temperature | -40°C~105°C TJ |
| Packaging | Tray |
| Published | 2008 |
| Series | StarCore |
| Part Status | Obsolete |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Type | SC140 Core |
| Base Part Number | MSC8101 |
| Interface | Communications Processor Module (CPM) |
| Voltage - I/O | 3.30V |
| Non-Volatile Memory | External |
| Voltage - Core | 1.60V |
| On Chip Data RAM | 512kB |
| Clock Rate | 275MHz |
| RoHS Status | ROHS3 Compliant |
MSC8101VT1375F Overview
It is a type of electronic component available in package 332-BFBGA, FCBGA.Packaging way Tray is provided.In addition to meeting a wide range of requirements, it is a member of SC140 Core.It is mounted in the direction of Surface Mount as shown in the image below.Operating at the temperature of -40°C~105°C TJ ensures its normal operation.Voltages can be input or output within 3.30V's analog voltage range.The StarCore series includes this digital signal processor.Based on its base part number of MSC8101, many ralated parts can be found.
MSC8101VT1375F Features
Supplied in the 332-BFBGA, FCBGA package
MSC8101VT1375F Applications
There are a lot of NXP USA Inc. MSC8101VT1375F DSP applications.
- Other sensor array processing
- Control systems
- Receivers
- 3D tomography and imaging processing
- Radar
- Audio signal
- Financial signals
- Video coding, audio coding
- Smart phones
- Seismology
