Parameters | |
---|---|
Factory Lead Time | 1 Week |
Mount | Socket |
Package / Case | 240-RDIMM |
Number of Pins | 240 |
Published | 2010 |
JESD-609 Code | e3 |
Pbfree Code | yes |
Part Status | Obsolete |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 240 |
Terminal Finish | MATTE TIN |
Max Operating Temperature | 70°C |
Min Operating Temperature | 0°C |
Additional Feature | SELF REFRESH; WD-MAX |
Subcategory | Other Memory ICs |
Technology | CMOS |
Terminal Position | DUAL |
Terminal Form | NO LEAD |
Peak Reflow Temperature (Cel) | 260 |
Number of Functions | 1 |
Supply Voltage | 1.8V |
Terminal Pitch | 1mm |
Time@Peak Reflow Temperature-Max (s) | 30 |
Qualification Status | Not Qualified |
Operating Supply Voltage | 1.8V |
Number of Elements | 36 |
Temperature Grade | COMMERCIAL |
Max Supply Voltage | 1.9V |
Min Supply Voltage | 1.7V |
Memory Size | 8GB |
Number of Ports | 1 |
Speed | 667MT/s |
Memory Type | DDR2 SDRAM |
Operating Mode | SYNCHRONOUS |
Clock Frequency | 333MHz |
Data Bus Width | 72b |
Organization | 1GX72 |
Output Characteristics | 3-STATE |
Memory Width | 72 |
Memory Density | 77309411328 bit |
Max Frequency | 667MHz |
Access Time (Max) | 0.45 ns |
I/O Type | COMMON |
Refresh Cycles | 8192 |
Access Mode | DUAL BANK PAGE BURST |
Height Seated (Max) | 30.5mm |
Length | 133.35mm |
RoHS Status | ROHS3 Compliant |