Parameters | |
---|---|
Mounting Type | Through Hole |
Surface Mount | NO |
Supplier Device Package | 18-DIP |
JESD-609 Code | e3 |
Pbfree Code | no |
Part Status | Obsolete |
Moisture Sensitivity Level (MSL) | NOT SPECIFIED |
Number of Terminations | 18 |
Terminal Finish | MATTE TIN |
Additional Feature | FULL DUPLEX |
Technology | CMOS |
Voltage - Supply | 5V |
Terminal Position | DUAL |
Peak Reflow Temperature (Cel) | 225 |
Number of Functions | 1 |
Supply Voltage | 5V |
Terminal Pitch | 2.54mm |
Time@Peak Reflow Temperature-Max (s) | 30 |
Pin Count | 18 |
JESD-30 Code | R-PDIP-T18 |
Qualification Status | COMMERCIAL |
Operating Temperature (Max) | 85°C |
Temperature Grade | OTHER |
Data Rate | 2 Mbps |
Telecom IC Type | MODEM |
Data Format | ASK |
Height Seated (Max) | 5.33mm |
Length | 22.86mm |
Width | 7.62mm |
RoHS Status | ROHS3 Compliant |