Parameters |
Pbfree Code |
no |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
Number of Terminations |
8 |
ECCN Code |
EAR99 |
Terminal Finish |
Tin/Lead (Sn/Pb) |
HTS Code |
8542.31.00.01 |
Technology |
CMOS |
Voltage - Supply |
4.75V~5.5V |
Terminal Position |
UPPER |
Terminal Form |
NO LEAD |
Peak Reflow Temperature (Cel) |
240 |
Supply Voltage |
5V |
Reach Compliance Code |
not_compliant |
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED |
Base Part Number |
MXD1210 |
Pin Count |
8 |
JESD-30 Code |
R-XUUC-N8 |
Qualification Status |
Not Qualified |
uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR CIRCUIT |
Supply Current-Max |
0.5mA |
Controller Type |
Nonvolatile RAM |
RoHS Status |
ROHS3 Compliant |
Package / Case |
Die |
Surface Mount |
YES |
Operating Temperature |
0°C~70°C |
Packaging |
Bulk |
JESD-609 Code |
e0 |
MXD1210C/D Overview
There is a packaging of Bulk materials included in the package. For the purpose of saving board space, it is provided in the Die. Having high quality and reliable performance, the Nonvolatile RAM is a type of product. A temperature of 0°C~70°C should be set for the operating environment. It is necessary to provide voltage to 4.75V~5.5V for the device to operate normally. Based on the base part number MXD1210, more related electronic components can be found. The transmission line ends are terminated with 8 terminations in order to prevent signals from reflecting off the end. The device has a 5V supply voltage. The 8 pins are configured on the board. It is based on the component with the lowest tolerance for high temperatures that we determine 240's reflow temperature limit. It is integrated with MICROPROCESSOR CIRCUIT as its uPs/uCs/peripheral IC type. A maximum supply current of 0.5mA should not be exceeded.
MXD1210C/D Features
Available in the Die package
Nonvolatile RAM as controller type
Operating temperature of 0°C~70°C
MXD1210C/D Applications
There are a lot of Maxim Integrated MXD1210C/D Memory Controllers applications.
- eMMC embedded Flash
- Embedded modules including U.2, M.2, MO-297 and MO-300
- Multi-Chip-Package (MCP)
- Servers
- Internet Appliances
- Point-of-Sale Systems
- CFast cards
- Embedded Systems
- System-in-Package (SiP) embedded flash drives (eSSD)
- Computers