Parameters | |
---|---|
Factory Lead Time | 1 Week |
Lifecycle Status | ACTIVE (Last Updated: 1 day ago) |
Mounting Type | Surface Mount |
Package / Case | 8-PowerTDFN |
Surface Mount | YES |
Number of Pins | 8 |
Transistor Element Material | SILICON |
Operating Temperature | -55°C~150°C TJ |
Packaging | Tape & Reel (TR) |
Published | 2012 |
JESD-609 Code | e3 |
Pbfree Code | yes |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 8 |
ECCN Code | EAR99 |
Terminal Finish | Tin (Sn) |
Max Power Dissipation | 1.2W |
Terminal Form | FLAT |
Pin Count | 8 |
Number of Elements | 2 |
Element Configuration | Dual |
Operating Mode | ENHANCEMENT MODE |
Case Connection | DRAIN SOURCE |
Power - Max | 1.1W 1.2W |
FET Type | 2 N-Channel (Dual), Schottky |
Transistor Application | SWITCHING |
Rds On (Max) @ Id, Vgs | 6.5m Ω @ 10A, 10V |
Vgs(th) (Max) @ Id | 2.2V @ 250μA |
Input Capacitance (Ciss) (Max) @ Vds | 1150pF @ 15V |
Current - Continuous Drain (Id) @ 25°C | 10.3A 17.9A |
Gate Charge (Qg) (Max) @ Vgs | 9.7nC @ 4.5V |
Drain to Source Voltage (Vdss) | 30V |
Continuous Drain Current (ID) | 17.9A |
Gate to Source Voltage (Vgs) | 20V |
Drain Current-Max (Abs) (ID) | 13.5A |
Drain-source On Resistance-Max | 0.01Ohm |
Pulsed Drain Current-Max (IDM) | 60A |
DS Breakdown Voltage-Min | 30V |
FET Technology | METAL-OXIDE SEMICONDUCTOR |
FET Feature | Logic Level Gate |
Radiation Hardening | No |
RoHS Status | ROHS3 Compliant |
Lead Free | Lead Free |