Parameters | |
---|---|
Factory Lead Time | 1 Week |
Lifecycle Status | ACTIVE (Last Updated: 2 days ago) |
Mounting Type | Surface Mount |
Package / Case | 3-XFLGA |
Surface Mount | YES |
Number of Pins | 3 |
Operating Temperature | -55°C~150°C TJ |
Packaging | Tape & Reel (TR) |
Published | 2012 |
JESD-609 Code | e4 |
Pbfree Code | yes |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
ECCN Code | EAR99 |
Terminal Finish | Nickel/Palladium/Gold (Ni/Pd/Au) |
Subcategory | FET General Purpose Power |
Technology | MOSFET (Metal Oxide) |
Pin Count | 3 |
Power Dissipation-Max | 120mW Ta |
Element Configuration | Single |
Turn On Delay Time | 18 ns |
FET Type | N-Channel |
Rds On (Max) @ Id, Vgs | 1.4 Ω @ 100mA, 4.5V |
Vgs(th) (Max) @ Id | 1V @ 250μA |
Input Capacitance (Ciss) (Max) @ Vds | 15.8pF @ 15V |
Current - Continuous Drain (Id) @ 25°C | 224mA Ta |
Gate Charge (Qg) (Max) @ Vgs | 0.7nC @ 4.5V |
Rise Time | 35ns |
Drive Voltage (Max Rds On,Min Rds On) | 1.5V 4.5V |
Vgs (Max) | ±8V |
Fall Time (Typ) | 110 ns |
Turn-Off Delay Time | 201 ns |
Continuous Drain Current (ID) | 224mA |
Gate to Source Voltage (Vgs) | 8V |
Drain Current-Max (Abs) (ID) | 0.224A |
Drain to Source Breakdown Voltage | 20V |
Radiation Hardening | No |
RoHS Status | ROHS3 Compliant |
Lead Free | Lead Free |