Parameters | |
---|---|
Factory Lead Time | 1 Week |
Mounting Type | Surface Mount |
Package / Case | SOT-563, SOT-666 |
Surface Mount | YES |
Transistor Element Material | SILICON |
Operating Temperature | -55°C~150°C TJ |
Packaging | Tape & Reel (TR) |
Published | 2011 |
Series | Automotive, AEC-Q101, TrenchMOS™ |
JESD-609 Code | e3 |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 6 |
Terminal Finish | Tin (Sn) |
Terminal Form | FLAT |
Pin Count | 6 |
Reference Standard | AEC-Q101; IEC-60134 |
JESD-30 Code | R-PDSO-F6 |
Number of Elements | 2 |
Configuration | SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE |
Operating Mode | ENHANCEMENT MODE |
Power - Max | 500mW |
FET Type | 2 N-Channel (Dual) |
Transistor Application | SWITCHING |
Rds On (Max) @ Id, Vgs | 1.4 Ω @ 350mA, 4.5V |
Vgs(th) (Max) @ Id | 1.1V @ 250μA |
Input Capacitance (Ciss) (Max) @ Vds | 50pF @ 15V |
Current - Continuous Drain (Id) @ 25°C | 400mA |
Gate Charge (Qg) (Max) @ Vgs | 0.68nC @ 4.5V |
Drain to Source Voltage (Vdss) | 30V |
Drain Current-Max (Abs) (ID) | 0.4A |
DS Breakdown Voltage-Min | 30V |
FET Technology | METAL-OXIDE SEMICONDUCTOR |
Power Dissipation-Max (Abs) | 0.39W |
FET Feature | Logic Level Gate |
RoHS Status | ROHS3 Compliant |