Parameters | |
---|---|
Factory Lead Time | 1 Week |
Surface Mount | YES |
Operating Temperature | -40°C~85°C |
Series | OSD335x |
Size / Dimension | 0.83 x 0.83 21mmx21mm |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 4 (72 Hours) |
Number of Terminations | 256 |
Connector Type | 256-BGA |
Additional Feature | GPMC OF 28 BIT-ADDRESS LINES AND 16 BIT-DATA LINES AVAILABLE |
Technology | CMOS |
Terminal Position | BOTTOM |
Terminal Form | BALL |
Terminal Pitch | 1.27mm |
JESD-30 Code | S-PBGA-B256 |
Speed | 1GHz |
RAM Size | 512MB |
uPs/uCs/Peripheral ICs Type | MICROPROCESSOR, RISC |
Core Processor | ARM® Cortex®-A8, AM3358 |
Boundary Scan | YES |
Module/Board Type | MPU Core |
Co-Processor | NEON™ SIMD |
Height Seated (Max) | 3.08mm |
Length | 21mm |
Width | 21mm |
RoHS Status | ROHS3 Compliant |