Parameters | |
---|---|
Factory Lead Time | 1 Week |
Mount | Surface Mount |
Mounting Type | Surface Mount |
Package / Case | 4-XFBGA, CSPBGA |
Number of Pins | 4 |
Transistor Element Material | SILICON |
Operating Temperature | -55°C~150°C TJ |
Packaging | Tape & Reel (TR) |
Published | 2013 |
Series | TrenchFET® |
JESD-609 Code | e3 |
Pbfree Code | yes |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 4 |
ECCN Code | EAR99 |
Terminal Finish | Matte Tin (Sn) |
Subcategory | Other Transistors |
Technology | MOSFET (Metal Oxide) |
Terminal Position | BOTTOM |
Terminal Form | BALL |
Peak Reflow Temperature (Cel) | 260 |
Time@Peak Reflow Temperature-Max (s) | 40 |
Pin Count | 4 |
Number of Elements | 1 |
Configuration | SINGLE WITH BUILT-IN DIODE |
Number of Channels | 1 |
Power Dissipation-Max | 1.47W Ta |
Operating Mode | ENHANCEMENT MODE |
Power Dissipation | 1.47W |
Turn On Delay Time | 31 ns |
FET Type | P-Channel |
Transistor Application | SWITCHING |
Rds On (Max) @ Id, Vgs | 48m Ω @ 1A, 4.5V |
Vgs(th) (Max) @ Id | 1.4V @ 250μA |
Current - Continuous Drain (Id) @ 25°C | 4.8A Ta |
Gate Charge (Qg) (Max) @ Vgs | 21nC @ 4.5V |
Rise Time | 50ns |
Drain to Source Voltage (Vdss) | 20V |
Drive Voltage (Max Rds On,Min Rds On) | 2.5V 4.5V |
Vgs (Max) | ±12V |
Fall Time (Typ) | 50 ns |
Turn-Off Delay Time | 105 ns |
Continuous Drain Current (ID) | -6.5A |
Gate to Source Voltage (Vgs) | 12V |
Drain-source On Resistance-Max | 0.063Ohm |
DS Breakdown Voltage-Min | 20V |
Height | 360μm |
Length | 1.6mm |
Width | 1.6mm |
Radiation Hardening | No |
RoHS Status | ROHS3 Compliant |