Parameters | |
---|---|
Factory Lead Time | 1 Week |
Packaging | Jar |
Series | SMD2 |
Part Status | Active |
Moisture Sensitivity Level (MSL) | Not Applicable |
Type | Solder Sphere |
Composition | Sn96.5Ag3Cu0.5 (96.5/3/0.5) |
Shelf Life | 24 Months |
Shelf Life Start | Date of Manufacture |
Form | Jar |
Process | Lead Free |
Melting Point | 423°F~428°F 217°C~220°C |
Diameter | 0.020 0.51mm |
RoHS Status | ROHS3 Compliant |