Parameters | |
---|---|
Factory Lead Time | 1 Week |
Mount | Solder |
Weight | 0.551lb 249.93g |
Packaging | Jar |
Published | 2015 |
Part Status | Active |
Moisture Sensitivity Level (MSL) | Not Applicable |
Type | Solder Paste |
Composition | Sn96.5Ag3Cu0.5 (96.5/3/0.5) |
Shelf Life | 6 Months, 2 Months |
Storage/Refrigeration Temperature | 37°F~46°F 3°C~8°C |
Shelf Life Start | Date of Manufacture |
Form | Jar, 8.8 oz (250g) |
Process | Lead Free |
Melting Point | 423°F~428°F 217°C~220°C |
Flux Type | Water Soluble |
RoHS Status | ROHS3 Compliant |