Parameters | |
---|---|
Factory Lead Time | 1 Week |
Mount | Surface Mount |
Package / Case | 2-VDFN Exposed Pad |
Number of Pins | 3 |
Diode Element Material | SILICON |
Operating Temperature | 175°C TJ |
Packaging | Cut Tape (CT) |
Published | 2010 |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 2 |
Termination | SMD/SMT |
ECCN Code | EAR99 |
HTS Code | 8541.10.00.80 |
Technology | POSITIVE-INTRINSIC-NEGATIVE |
Terminal Position | DUAL |
Terminal Form | C BEND |
Peak Reflow Temperature (Cel) | 260 |
Base Part Number | SMP1330-085 |
Pin Count | 3 |
JESD-30 Code | S-PDSO-C2 |
Number of Elements | 1 |
Max Current Rating | 200mA |
Power Dissipation-Max | 3W |
Element Configuration | Common Anode |
Diode Type | PIN - Single |
Power Dissipation | 30W |
Case Connection | CATHODE |
Forward Current | 200mA |
Application | LIMITER |
Capacitance @ Vr, F | 1pF @ 0V 1MHz |
Reverse Voltage | 50V |
Reverse Voltage (DC) | 50V |
Frequency Band | HIGH FREQUENCY TO C B |
Resistance @ If, F | 2Ohm @ 10mA 100MHz |
Diode Capacitance-Max | 1pF |
Minority Carrier Lifetime-Nom | 0.004 μs |
Diode Forward Resistance-Max | 2Ohm |
Radiation Hardening | No |
RoHS Status | ROHS3 Compliant |