Parameters |
Mounting Type |
Surface Mount |
Package / Case |
96-LFBGA |
Supplier Device Package |
96-PBGA MICROSTAR (13.6x5.6) |
Operating Temperature |
0°C~70°C |
Packaging |
Tape & Reel (TR) |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Supply Voltage |
1.7V~1.9V |
Number of Bits |
25, 14 |
Logic Type |
1:1, 1:2 Configurable Registered Buffer |
RoHS Status |
ROHS3 Compliant |
SN74SSTU32864EZKER Overview
As a packaging method, Tape & Reel (TR) is used.There is a 96-LFBGA package containing it.1.7V~1.9V is provided to ensure that the device works normally.Electronic parts mounted using the Surface Mount method.It is set to operate at a temperature of 0°C~70°C.Approximately 25, 14 bits of information can be stored in the memory.
SN74SSTU32864EZKER Features
SN74SSTU32864EZKER Applications
There are a lot of Rochester Electronics, LLC SN74SSTU32864EZKER Specialty Logic ICs applications.
- Telecom and datacom networking applications
- Wireless multimedia center in smart home
- Wireless 3D game
- Wireless showroom
- Ethernet circuitry
- Thermal management
- Optical sub-assembly (OSA)
- Satellite ground stations and transmission stations
- Wireless communication
- Copper and fiber optic cables connection network