SP12
| Parameters | |
|---|---|
| Package / Case | SOIC |
| Surface Mount | YES |
| Packaging | Tape & Reel (TR) |
| JESD-609 Code | e3 |
| Pbfree Code | yes |
| Part Status | Obsolete |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Number of Terminations | 4 |
| Termination | SMD/SMT |
| ECCN Code | EAR99 |
| Terminal Finish | Tin (Sn) |
| Max Operating Temperature | 125°C |
| Min Operating Temperature | -40°C |
| HTS Code | 8541.29.00.95 |
| Terminal Position | DUAL |
| Terminal Form | GULL WING |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| Pin Count | 4 |
| Reference Standard | AEC-Q101 |
| JESD-30 Code | R-PDSO-G4 |
| Number of Elements | 1 |
| Configuration | SINGLE WITH BUILT-IN DIODE |
| Operating Mode | DEPLETION MODE |
| Case Connection | DRAIN |
| Pressure Type | Gauge |
| Polarity/Channel Type | N-CHANNEL |
| Drain Current-Max (Abs) (ID) | 0.35A |
| Drain-source On Resistance-Max | 20Ohm |
| Pulsed Drain Current-Max (IDM) | 1.4A |
| DS Breakdown Voltage-Min | 240V |
| FET Technology | METAL-OXIDE SEMICONDUCTOR |
| RoHS Status | Non-RoHS Compliant |
| Lead Free | Contains Lead |
See Relate Datesheet
