Parameters | |
---|---|
Factory Lead Time | 1 Week |
Mounting Type | Surface Mount |
Package / Case | DO-214AC, SMA |
Surface Mount | YES |
Diode Element Material | SILICON |
Packaging | Cut Tape (CT) |
Published | 2008 |
JESD-609 Code | e3 |
Pbfree Code | yes |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 2 |
Terminal Finish | Matte Tin (Sn) |
Terminal Position | DUAL |
Terminal Form | C BEND |
Peak Reflow Temperature (Cel) | 260 |
Time@Peak Reflow Temperature-Max (s) | 10 |
Base Part Number | SS2150 |
Pin Count | 2 |
JESD-30 Code | R-PDSO-C2 |
Qualification Status | Not Qualified |
Operating Temperature (Max) | 125°C |
Number of Elements | 1 |
Configuration | SINGLE |
Speed | Fast Recovery =< 500ns, > 200mA (Io) |
Diode Type | Schottky |
Current - Reverse Leakage @ Vr | 500μA @ 150V |
Voltage - Forward (Vf) (Max) @ If | 900mV @ 2A |
Operating Temperature - Junction | -55°C~125°C |
Output Current-Max | 2A |
Application | GENERAL PURPOSE |
Voltage - DC Reverse (Vr) (Max) | 150V |
Current - Average Rectified (Io) | 2A |
Number of Phases | 1 |
Rep Pk Reverse Voltage-Max | 150V |
Capacitance @ Vr, F | 170pF @ 4V 1MHz |
Non-rep Pk Forward Current-Max | 50A |
RoHS Status | ROHS3 Compliant |