SSTUH32865ET/G,551

28 Bit 1:2 Registered Buffer with Parity 0°C~70°C Specialty Logic IC 74SSTUH32865 0.65mm 1.7V~1.9V 160-TFBGA

Manufacturer: NXP USA Inc.
Nocochips NO: 568-SSTUH32865ET/G,551
Package: 160-TFBGA
Datasheet: PDF
Stock: 204
Description: 28 Bit 1:2 Registered Buffer with Parity 0°C~70°C Specialty Logic IC 74SSTUH32865 0.65mm 1.7V~1.9V 160-TFBGA (Kg)

Details

Tags

Parameters
Mounting Type	Surface Mount
Package / Case	160-TFBGA
Surface Mount	YES
Operating Temperature	0°C~70°C
Packaging	Tray
Published	2005
Part Status	Obsolete
Moisture Sensitivity Level (MSL)	3 (168 Hours)
Number of Terminations	160
HTS Code	8542.39.00.01
Technology	CMOS
Terminal Position	BOTTOM
Terminal Form	BALL
Peak Reflow Temperature (Cel)	260
Number of Functions	1
Supply Voltage	1.7V~1.9V
Terminal Pitch	0.65mm
Time@Peak Reflow Temperature-Max (s)	30
Base Part Number	74SSTUH32865
Pin Count	160
JESD-30 Code	R-PBGA-B160
Qualification Status	Not Qualified
Number of Bits	28
Output Characteristics	OPEN-DRAIN
Logic Type	1:2 Registered Buffer with Parity
Output Polarity	COMPLEMENTARY
Trigger Type	POSITIVE EDGE
Propagation Delay (tpd)	1.8 ns
fmax-Min	450 MHz
Height Seated (Max)	1.2mm
Length	13mm
Width	9mm
RoHS Status	ROHS3 Compliant

SSTUH32865ET/G,551 Overview

Tray is employed as a way of packaging.It is accessible to the 160-TFBGA package.Providing a voltage of 1.7V~1.9V ensures proper function of the device.It is a type of electronic part mounted in the way of Surface Mount.In terms of its operating temperature, it is set at 0°C~70°C.Information can be stored in the memory at the rate of 28 bits.On the basis of its base part number 74SSTUH32865, you can find a number of related parts.It adds up to 160 when all component pins are added together.Through 160 terminations, signals are prevented from reflecting off the end of transmission lines.