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SSTUH32866EC/G,551

25, 14 Bit 1:1, 1:2 Configurable Registered Buffer with Parity 0°C~70°C Specialty Logic IC 74SSTUH32866 0.8mm 1.7V~1.9V 96-LFBGA


  • Manufacturer: NXP USA Inc.
  • Nocochips NO: 568-SSTUH32866EC/G,551
  • Package: 96-LFBGA
  • Datasheet: PDF
  • Stock: 768
  • Description: 25, 14 Bit 1:1, 1:2 Configurable Registered Buffer with Parity 0°C~70°C Specialty Logic IC 74SSTUH32866 0.8mm 1.7V~1.9V 96-LFBGA (Kg)

Details

Tags

Parameters
Width 5.5mm
RoHS Status ROHS3 Compliant
Mounting Type Surface Mount
Package / Case 96-LFBGA
Surface Mount YES
Operating Temperature 0°C~70°C
Packaging Tray
Published 2005
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 96
HTS Code 8542.39.00.01
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 260
Number of Functions 1
Supply Voltage 1.7V~1.9V
Terminal Pitch 0.8mm
Reach Compliance Code unknown
Time@Peak Reflow Temperature-Max (s) 30
Base Part Number 74SSTUH32866
Pin Count 96
JESD-30 Code R-PBGA-B96
Qualification Status Not Qualified
Number of Bits 25, 14
Logic Type 1:1, 1:2 Configurable Registered Buffer with Parity
Output Polarity TRUE
Trigger Type POSITIVE EDGE
Propagation Delay (tpd) 1.8 ns
fmax-Min 450 MHz
Height Seated (Max) 1.5mm
Length 13.5mm

SSTUH32866EC/G,551 Overview


As a packaging method, Tray is used.You can find it in package 96-LFBGA.The voltage of 1.7V~1.9V is supplied to make sure that the device is able to operate normally.Electronic parts mounted in the way of Surface Mount are referred to as this type. 0°C~70°C is set as its operating temperature.Information can be stored in the memory at the rate of 25, 14 bits.Its base part number 74SSTUH32866 identifies a number of related parts.There are 96 pins on all component boards.Through 96 terminations, signals are prevented from reflecting off the end of transmission lines.

SSTUH32866EC/G,551 Features



SSTUH32866EC/G,551 Applications


There are a lot of NXP USA Inc. SSTUH32866EC/G,551 Specialty Logic ICs applications.

  • Copper and fiber optic cables connection network
  • Solenoids
  • Wireless smart house
  • Pocket PC
  • Televisions
  • interconnection between computers
  • Carrier phase observations
  • Wireless projection application for conferences and business talks
  • Digital systems
  • Structural bonding

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