banner_page

TC1-20G

HEAT SINK COMPOUND - HIGH DENSIT


  • Manufacturer: Chip Quik Inc.
  • Nocochips NO: 138-TC1-20G
  • Package: -
  • Datasheet: PDF
  • Stock: 342
  • Description: HEAT SINK COMPOUND - HIGH DENSIT (Kg)

Details

Tags

Parameters
Factory Lead Time 1 Week
Size / Dimension 20 gram Syringe
Part Status Active
Moisture Sensitivity Level (MSL) Not Applicable
Type Silicone Compound
Color White
Shelf Life 60 Months
Storage/Refrigeration Temperature 37°F~77°F 3°C~25°C
Shelf Life Start Date of Manufacture
Thermal Conductivity 0.67W/m-K
RoHS Status ROHS3 Compliant
See Relate Datesheet

Write a review

Note: HTML is not translated!
    Bad           Good