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TEA1791AT/N1,118

TEA1791AT/N1,118 datasheet pdf and PMIC - Power Supply Controllers, Monitors product details from NXP USA Inc. stock available at Noco


  • Manufacturer: NXP USA Inc.
  • Nocochips NO: 568-TEA1791AT/N1,118
  • Package: 8-SOIC (0.154, 3.90mm Width)
  • Datasheet: PDF
  • Stock: 910
  • Description: TEA1791AT/N1,118 datasheet pdf and PMIC - Power Supply Controllers, Monitors product details from NXP USA Inc. stock available at Noco(Kg)

Details

Tags

Parameters
Factory Lead Time 1 Week
Mounting Type Surface Mount
Package / Case 8-SOIC (0.154, 3.90mm Width)
Operating Temperature -40°C~150°C
Packaging Tape & Reel (TR)
Published 2009
Series GreenChip™
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Applications Secondary-Side Controller
Voltage - Supply 8.5V~38V
Base Part Number TEA1791
Pin Count 8
Current - Supply 950μA
RoHS Status ROHS3 Compliant

TEA1791AT/N1,118 Overview


There is a Tape & Reel (TR) package attached to it. As a space-saving measure, it is included in the 8-SOIC (0.154, 3.90mm Width) package. Surface Mount tells us how to mount it. A temperature of -40°C~150°C should be maintained when the device is functioning. The device is an outstanding choice for Secondary-Side Controller owing to its outstanding performance. Due to the low 8.5V~38V supply voltage, the system is capable of high efficiency. It is equipped with a total of 8 pins. Identifiable components can be found by using a base part number of TEA1791. A total of 950μA current has been supplied to the device. In the GreenChip? series, you will find this type of electrical component.

TEA1791AT/N1,118 Features


8-SOIC (0.154, 3.90mm Width) package
Mounting type of Surface Mount

TEA1791AT/N1,118 Applications


There are a lot of NXP USA Inc. TEA1791AT/N1,118 Power Supply Control ICs applications.

  • I/O and DDR or DDR2 termination
  • LCD flipper
  • Electric curtains
  • Microphone
  • Multi-purposed meeting room
  • Telecommunications
  • Various consumer terminal equipment
  • Sound system equipment
  • Isolated dc-dc module
  • Large conference system engineering

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