Parameters |
Factory Lead Time |
1 Week |
Mounting Type |
Surface Mount |
Package / Case |
256-BGA |
Supplier Device Package |
256-PBGA (17x17) |
Packaging |
Tray |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
4 (72 Hours) |
Voltage - Supply |
1V 2.5V |
Function |
Ethernet |
Interface |
RMII |
Number of Circuits |
2 |
RoHS Status |
ROHS3 Compliant |
VSC8572XKS-05 Overview
The 256-BGA package reduces the amount of space on a board.Packing is done according to the Tray method.The mounting type is Surface Mount.Telecommunications equipment consists of 2 circuits.When 1V 2.5V is supplied wtelecom IC's efficiencyh power, efficiency can be improved.
VSC8572XKS-05 Features
Available in the 256-BGA package
VSC8572XKS-05 Applications
There are a lot of Microchip Technology VSC8572XKS-05 Telecom applications.
- Inverse Multiplexing for ATM (IMA)
- PDH Multiplexers
- Digital Cross-Connect Systems
- Digital access cross connects
- SDH/SONET multiplexers
- Switching Systems
- ISDN terminal adapter
- Digital cross connects (DSX-1)
- M13 MUX
- Fractional T1/E1/J1