XC1701LPDG8C
| Parameters | |
|---|---|
| Mounting Type | Through Hole |
| Package / Case | 8-DIP (0.300, 7.62mm) |
| Surface Mount | NO |
| Number of Pins | 8 |
| Operating Temperature | 0°C~70°C |
| Packaging | Tube |
| Published | 2004 |
| JESD-609 Code | e3 |
| Pbfree Code | yes |
| Part Status | Obsolete |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Number of Terminations | 8 |
| Terminal Finish | Matte Tin (Sn) |
| Additional Feature | USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS |
| Technology | CMOS |
| Voltage - Supply | 3V~3.6V |
| Terminal Position | DUAL |
| Peak Reflow Temperature (Cel) | 250 |
| Number of Functions | 1 |
| Supply Voltage | 3.3V |
| Terminal Pitch | 2.54mm |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Base Part Number | XC1701L |
| Pin Count | 8 |
| Qualification Status | Not Qualified |
| Supply Voltage-Max (Vsup) | 3.6V |
| Power Supplies | 3.3V |
| Supply Voltage-Min (Vsup) | 3V |
| Programmable Type | OTP |
| Memory Size | 1Mb |
| Operating Mode | SYNCHRONOUS |
| Clock Frequency | 15MHz |
| Supply Current-Max | 0.01mA |
| Organization | 1MX1 |
| Output Characteristics | 3-STATE |
| Memory Width | 1 |
| Standby Current-Max | 0.00005A |
| Parallel/Serial | SERIAL |
| I/O Type | COMMON |
| Memory IC Type | CONFIGURATION MEMORY |
| Height Seated (Max) | 4.5974mm |
| Length | 9.3599mm |
| Width | 7.62mm |
| RoHS Status | RoHS Compliant |
XC1701LPDG8C Overview
The package uses a neat 8-DIP (0.300, 7.62mm) interface.Packaging outside of Tube.As a qualified employee, I can operate within 0°C~70°C.Through OTP, it is programmable.A voltage of 3V~3.6V is applied to it.There is a memory device mounted in Through Hole position for this device.Data storage is limited to a size of 1Mb bytes.Search "XC1701L" for related parts.The supply voltage of the device must be 3.3V in order to operate correctly.FPGA is possible to connect different functions on the 8 axis at different terminations.This memory device can be used with a maximum voltage of 3.6V.FPGA is essential that a minimum voltage of 3V be supplied to the device in order for FPGA to function.Using the CONFIGURATION MEMORY memory chip, we can store data.FPGA is recommended that the reflow soldering temperature be maintained at no more than 250 during the process.The 8 pins are on the board.Through SERIAL-processing, data is transmitted from this memory to the CPU.The memory chip is allowed to operate at a voltage that is no greater than 0.01mA.Parts include 8 pins.I would like to mention that this is a memory IC that will be able to work at a 15MHz frequency, so I will mention that.The I/O configuration of the memory is COMMON.A power supply that is rated at 3.3V is recommended for use with this product.Thus, USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS is included to better serve customers.
XC1701LPDG8C Features
Operating temperature: 0°C~70°C.
OTP program capability.
CONFIGURATION MEMORY memory IC.
SERIAL processing.
COMMON I/O equipped.
XC1701LPDG8C Applications
There are a lot of Xilinx Inc. XC1701LPDG8C applications of configuration proms for FPGAs.
- data buffer
- telecommunications
- hard disk drive (HDD)
- personal digital assistants
- Cache memory
- personal computers
- supercomputers
- embedded logic
- mainframes
- servers
