XC17S10XLPD8I
| Parameters | |
|---|---|
| Mounting Type | Through Hole |
| Package / Case | 8-DIP (0.300, 7.62mm) |
| Surface Mount | NO |
| Number of Pins | 8 |
| Operating Temperature | -40°C~85°C |
| Packaging | Tube |
| Published | 1999 |
| JESD-609 Code | e0 |
| Part Status | Obsolete |
| Moisture Sensitivity Level (MSL) | Not Applicable |
| Number of Terminations | 8 |
| ECCN Code | EAR99 |
| Technology | CMOS |
| Voltage - Supply | 3V~3.6V |
| Terminal Position | DUAL |
| Number of Functions | 1 |
| Supply Voltage | 3.3V |
| Terminal Pitch | 2.54mm |
| Base Part Number | XC17S10XL |
| Pin Count | 8 |
| Operating Supply Voltage | 3.3V |
| Supply Voltage-Max (Vsup) | 3.6V |
| Supply Voltage-Min (Vsup) | 3V |
| Programmable Type | OTP |
| Memory Size | 100kb |
| Clock Frequency | 10MHz |
| Supply Current-Max | 0.005mA |
| Organization | 95752X1 |
| Output Characteristics | 3-STATE |
| Memory Width | 1 |
| Density | 93.5 kb |
| Standby Current-Max | 0.00005A |
| I/O Type | COMMON |
| Memory IC Type | MEMORY CIRCUIT |
| Height Seated (Max) | 4.5974mm |
| Length | 9.3599mm |
| Width | 7.62mm |
| Radiation Hardening | No |
| RoHS Status | Non-RoHS Compliant |
| Lead Free | Contains Lead |
XC17S10XLPD8I Overview
8-DIP (0.300, 7.62mm) is used in this package.Packaging for Tube.-40°C~85°C license holder.Through OTP, it is programmable.FPGA is powered by a voltage which is 3V~3.6V volts, and this voltage is the voltage from which the generator is powered.Through Hole is the mounting position of this memory device.A data storage size of 100kb is allowed.For other related parts, search "XC17S10XL".The supply voltage is 3.3V.Different types of 8 terminations are available with different functions.A maximum voltage of 3.6V can be applied to this memory device.There must be a minimum voltage of 3V to supply the device with the power it needs.Using the MEMORY CIRCUIT memory chip, we can store data.FPGA has pins on the 8 axis.The memory chip will not operate at a voltage above 0.005mA.Parts come with 8 pins set.Using a 10MHz frequency, this memory IC can work at high speeds.Memory is configured as COMMON for memory's I/O.A 3.3V application is recommended before using the part in a circuit to ensure the part runs safely and reliably.
XC17S10XLPD8I Features
Operating temperature: -40°C~85°C.
OTP program capability.
MEMORY CIRCUIT memory IC.
COMMON I/O equipped.
XC17S10XLPD8I Applications
There are a lot of Xilinx Inc. XC17S10XLPD8I applications of configuration proms for FPGAs.
- personal digital assistants
- multimedia computers
- telecommunications
- Camcorders
- data buffer
- eSRAM
- embedded logic
- hard disk drive (HDD)
- graphics card
- mainframes
