XC17S15AVOG8C
| Parameters | |
|---|---|
| Number of Terminations | 8 |
| ECCN Code | EAR99 |
| Terminal Finish | Matte Tin (Sn) |
| Technology | CMOS |
| Voltage - Supply | 3V~3.6V |
| Terminal Position | DUAL |
| Terminal Form | GULL WING |
| Peak Reflow Temperature (Cel) | 260 |
| Number of Functions | 1 |
| Supply Voltage | 3.3V |
| Terminal Pitch | 1.27mm |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Base Part Number | XC17S15A |
| Pin Count | 8 |
| Operating Supply Voltage | 3.3V |
| Supply Voltage-Max (Vsup) | 3.6V |
| Supply Voltage-Min (Vsup) | 3V |
| Programmable Type | OTP |
| Memory Size | 150kb |
| Supply Current-Max | 0.015mA |
| Organization | 197696X1 |
| Output Characteristics | 3-STATE |
| Memory Width | 1 |
| Density | 512 kb |
| Standby Current-Max | 0.001A |
| Parallel/Serial | SERIAL |
| I/O Type | COMMON |
| Memory IC Type | CONFIGURATION MEMORY |
| Height Seated (Max) | 1.2mm |
| Length | 4.9mm |
| Width | 3.9mm |
| Radiation Hardening | No |
| RoHS Status | RoHS Compliant |
| Mounting Type | Surface Mount |
| Package / Case | 8-SOIC (0.154, 3.90mm Width) |
| Surface Mount | YES |
| Number of Pins | 8 |
| Operating Temperature | 0°C~70°C |
| Packaging | Tray |
| Published | 1999 |
| JESD-609 Code | e3 |
| Pbfree Code | yes |
| Part Status | Obsolete |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
XC17S15AVOG8C Overview
8-SOIC (0.154, 3.90mm Width) is used in this package.External packaging of type Tray.Qualified to perform a variety of tasks within the 0°C~70°C environment.This device can be programmed using OTP.A voltage of 3V~3.6V is applied to it in order to power it.There is a memory device mounted in Surface Mount.The size of data storage is limited to 150kb.Other related parts can be found by searching "XC17S15A".The supply voltage of the device must be 3.3V in order to operate correctly.There are different functions associated with 8 terminations.FPGA is possible to use this memory device wFPGAh a maximum voltage of 3.6V.To supply the device, a minimum voltage of 3V is a must.The memory chip in this picture is called a CONFIGURATION MEMORY memory chip.If reflow soldering is being performed, the temperature should not be higher than 260 when soldering should be reflowed.FPGA has 8 pins.As a result of the SERIAL process, data is transmitted from this memory.In order for a memory chip to function properly, it must be subjected to a voltage of not more than 0.015mA.8 pins are set with the part.Memory is configured as COMMON for memory's I/O.A 3.3V application is recommended before using the part in a circuit to ensure the part runs safely and reliably.
XC17S15AVOG8C Features
Operating temperature: 0°C~70°C.
OTP program capability.
CONFIGURATION MEMORY memory IC.
SERIAL processing.
COMMON I/O equipped.
XC17S15AVOG8C Applications
There are a lot of Xilinx Inc. XC17S15AVOG8C applications of configuration proms for FPGAs.
- telecommunications
- cell phones
- main computer memory
- servers
- Camcorders
- multimedia computers
- mainframes
- nonvolatile BIOS memory
- networks
- personal digital assistants
