XC17S30APD8C
| Parameters | |
|---|---|
| Mounting Type | Through Hole |
| Package / Case | 8-DIP (0.300, 7.62mm) |
| Surface Mount | NO |
| Number of Pins | 8 |
| Operating Temperature | 0°C~70°C |
| Packaging | Tube |
| Published | 1999 |
| JESD-609 Code | e0 |
| Pbfree Code | no |
| Part Status | Obsolete |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Number of Terminations | 8 |
| ECCN Code | EAR99 |
| Technology | CMOS |
| Voltage - Supply | 3V~3.6V |
| Terminal Position | DUAL |
| Peak Reflow Temperature (Cel) | 225 |
| Number of Functions | 1 |
| Supply Voltage | 3.3V |
| Terminal Pitch | 2.54mm |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Base Part Number | XC17S30 |
| Pin Count | 8 |
| Operating Supply Voltage | 3.3V |
| Supply Voltage-Max (Vsup) | 3.6V |
| Supply Voltage-Min (Vsup) | 3V |
| Programmable Type | OTP |
| Memory Size | 300kb |
| Supply Current-Max | 0.005mA |
| Output Characteristics | 3-STATE |
| Memory Width | 1 |
| Density | 512 kb |
| Standby Current-Max | 0.00005A |
| Parallel/Serial | SERIAL |
| I/O Type | COMMON |
| Memory IC Type | CONFIGURATION MEMORY |
| Height Seated (Max) | 4.5974mm |
| Length | 9.3599mm |
| Width | 7.62mm |
| Radiation Hardening | No |
| RoHS Status | Non-RoHS Compliant |
| Lead Free | Contains Lead |
XC17S30APD8C Overview
There is a neat 8-DIP (0.300, 7.62mm) package that is used in this program.Packing on the outside is Tube.0°C~70°C license holder.The OTP programming language can be used to program it.A voltage of 3V~3.6V is applied to it.This memory device is mounted in Through Hole.Data storage is limited to 300kb bytes.To find other similar parts, search for "XC17S30".The supply voltage should be 3.3V.Different functions are associated with 8 terminations.With 3.6V as the maximum voltage, the memory device can be used.To supply the device, a minimum voltage of 3V is a must.The memory chip in question is a CONFIGURATION MEMORY memory chip.FPGA is recommended that the reflow soldering temperature be maintained at no more than 225 during the process.Pins on it are 8-shaped.SERIAL-process memory transmits data.The memory chip operates at a voltage of no more than 0.005mA.With the part are included 8 pins.A COMMON configuration is used for the memory's I/O.Memory is recommended that users apply 3.3V to the part before use in order for Memory to function safely in a circuMemory.
XC17S30APD8C Features
Operating temperature: 0°C~70°C.
OTP program capability.
CONFIGURATION MEMORY memory IC.
SERIAL processing.
COMMON I/O equipped.
XC17S30APD8C Applications
There are a lot of Xilinx Inc. XC17S30APD8C applications of configuration proms for FPGAs.
- DVD disk buffer
- cell phones
- workstations,
- personal digital assistants
- personal computers
- eSRAM
- eDRAM
- servers
- graphics card
- telecommunications
