XC17S50APD8C
| Parameters | |
|---|---|
| Mounting Type | Through Hole |
| Package / Case | 8-DIP (0.300, 7.62mm) |
| Surface Mount | NO |
| Number of Pins | 8 |
| Operating Temperature | 0°C~70°C |
| Packaging | Tube |
| Published | 1999 |
| JESD-609 Code | e0 |
| Pbfree Code | no |
| Part Status | Obsolete |
| Moisture Sensitivity Level (MSL) | Not Applicable |
| Number of Terminations | 8 |
| ECCN Code | EAR99 |
| Technology | CMOS |
| Voltage - Supply | 3V~3.6V |
| Terminal Position | DUAL |
| Peak Reflow Temperature (Cel) | 225 |
| Number of Functions | 1 |
| Supply Voltage | 3.3V |
| Terminal Pitch | 2.54mm |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Base Part Number | XC17S50A |
| Pin Count | 8 |
| Operating Supply Voltage | 3.3V |
| Supply Voltage-Max (Vsup) | 3.6V |
| Supply Voltage-Min (Vsup) | 3V |
| Programmable Type | OTP |
| Memory Size | 500kb |
| Supply Current-Max | 0.015mA |
| Organization | 559200X1 |
| Output Characteristics | 3-STATE |
| Memory Width | 1 |
| Density | 1 Mb |
| Standby Current-Max | 0.001A |
| Parallel/Serial | SERIAL |
| I/O Type | COMMON |
| Memory IC Type | CONFIGURATION MEMORY |
| Height Seated (Max) | 4.5974mm |
| Length | 9.3599mm |
| Width | 7.62mm |
| Radiation Hardening | No |
| RoHS Status | Non-RoHS Compliant |
| Lead Free | Contains Lead |
XC17S50APD8C Overview
FPGA uses a nice 8-DIP (0.300, 7.62mm) package that makes FPGA easy to use.External packaging of type Tube.A qualified individual who has the ability to operate within 0°C~70°C.With the help of OTP, it can be programmed.With a voltage of 3V~3.6V, it is powered.I have mounted this memory device in Through Hole.500kb is the maximum storage size.Other related parts can be found by searching "XC17S50A".The supply voltage of the device must be 3.3V in order to operate correctly.8 terminations with different functions.FPGA is possible to use this memory device wFPGAh a maximum voltage of 3.6V.There must be a minimum voltage of 3V to supply the device with the power it needs.The memory chip in this picture is called a CONFIGURATION MEMORY memory chip.FPGA is recommended that the reflow soldering temperature be maintained at no more than 225 during the process.FPGA is equipped wFPGAh 8 pins.In this memory, data is transmitted using the SERIAL process.An operating voltage of 0.015mA is allowed for the memory chip.As part of the package, the part comes with a set of 8 pins.A COMMON configuration is used for the memory's I/O.In order for the part to function safely and reliably as part of a circuit, 3.3V recommends that users apply 3.3V to the part prior to use in order to ensure that it will work properly.
XC17S50APD8C Features
Operating temperature: 0°C~70°C.
OTP program capability.
CONFIGURATION MEMORY memory IC.
SERIAL processing.
COMMON I/O equipped.
XC17S50APD8C Applications
There are a lot of Xilinx Inc. XC17S50APD8C applications of configuration proms for FPGAs.
- data buffer
- networking
- printers
- eSRAM
- eDRAM
- cell phones
- Camcorders
- DVD disk buffer
- embedded logic
- networks
