XC17S50APDG8C
| Parameters | |
|---|---|
| Mounting Type | Through Hole |
| Package / Case | 8-DIP (0.300, 7.62mm) |
| Surface Mount | NO |
| Number of Pins | 8 |
| Operating Temperature | 0°C~70°C |
| Packaging | Tube |
| Published | 1999 |
| JESD-609 Code | e3 |
| Pbfree Code | yes |
| Part Status | Obsolete |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Number of Terminations | 8 |
| ECCN Code | EAR99 |
| Terminal Finish | Matte Tin (Sn) |
| Technology | CMOS |
| Voltage - Supply | 3V~3.6V |
| Terminal Position | DUAL |
| Peak Reflow Temperature (Cel) | 250 |
| Number of Functions | 1 |
| Supply Voltage | 3.3V |
| Terminal Pitch | 2.54mm |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Base Part Number | XC17S50A |
| Pin Count | 8 |
| Operating Supply Voltage | 3.3V |
| Supply Voltage-Max (Vsup) | 3.6V |
| Supply Voltage-Min (Vsup) | 3V |
| Programmable Type | OTP |
| Memory Size | 500kb |
| Supply Current-Max | 0.015mA |
| Organization | 559200X1 |
| Output Characteristics | 3-STATE |
| Memory Width | 1 |
| Density | 1 Mb |
| Standby Current-Max | 0.001A |
| Parallel/Serial | SERIAL |
| I/O Type | COMMON |
| Memory IC Type | CONFIGURATION MEMORY |
| Height Seated (Max) | 4.5974mm |
| Length | 9.3599mm |
| Width | 7.62mm |
| Radiation Hardening | No |
| RoHS Status | RoHS Compliant |
XC17S50APDG8C Overview
This package makes use of the 8-DIP (0.300, 7.62mm) programming language.Packaging for the external environment.In the state of 0°C~70°C, licensed to work.FPGA is programmable through OTP.The voltage is 3V~3.6V.This memory device is mounted in Through Hole.500kb is the maximum storage size.Look for "XC17S50A" for other related parts.In order for it to function, it requires a voltage supply of 3.3V.Various functions can be applied to 8 terminations.In order to use this memory device, a maximum voltage of 3.6V should be used.3V is the minimum voltage required to supply the device.This is a CONFIGURATION MEMORY memory chip.The reflow soldering process should be done at a temperature no higher than 250.Pins on it are 8-shaped.Through SERIAL-processing, data is transmitted from this memory to the CPU.A memory chip can operate at a voltage no greater than 0.015mA.Parts come with 8 pins.A COMMON configuration is used for the memory's I/O.Memory is recommended that users apply 3.3V to the part before use in order for Memory to function safely in a circuMemory.
XC17S50APDG8C Features
Operating temperature: 0°C~70°C.
OTP program capability.
CONFIGURATION MEMORY memory IC.
SERIAL processing.
COMMON I/O equipped.
XC17S50APDG8C Applications
There are a lot of Xilinx Inc. XC17S50APDG8C applications of configuration proms for FPGAs.
- data buffer
- main computer memory
- mainframes
- workstations,
- supercomputers
- embedded logic
- personal digital assistants
- cell phones
- networks
- DVD disk buffer
