XC3S50AN-4TQG144C
| Parameters | |
|---|---|
| REACH SVHC | Unknown |
| RoHS Status | ROHS3 Compliant |
| Factory Lead Time | 1 Week |
| Contact Plating | Tin |
| Mount | Surface Mount |
| Mounting Type | Surface Mount |
| Package / Case | 144-LQFP |
| Number of Pins | 144 |
| Operating Temperature | 0°C~85°C TJ |
| Packaging | Tray |
| Published | 2007 |
| Series | Spartan®-3AN |
| JESD-609 Code | e3 |
| Pbfree Code | yes |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of Terminations | 144 |
| Termination | SMD/SMT |
| ECCN Code | EAR99 |
| Subcategory | Field Programmable Gate Arrays |
| Technology | CMOS |
| Voltage - Supply | 1.14V~1.26V |
| Terminal Position | QUAD |
| Terminal Form | GULL WING |
| Peak Reflow Temperature (Cel) | 260 |
| Supply Voltage | 1.2V |
| Terminal Pitch | 0.5mm |
| Frequency | 667MHz |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Base Part Number | XC3S50AN |
| Pin Count | 144 |
| Number of Outputs | 101 |
| Qualification Status | Not Qualified |
| Operating Supply Voltage | 1.2V |
| Power Supplies | 1.21.2/3.33.3V |
| Number of I/O | 108 |
| RAM Size | 6.8kB |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY |
| Total RAM Bits | 55296 |
| Number of Gates | 50000 |
| Number of LABs/CLBs | 176 |
| Speed Grade | 4 |
| Number of Macro Cells | 1584 |
| Combinatorial Delay of a CLB-Max | 0.71 ns |
| Number of CLBs | 176 |
| Height | 1.4mm |
| Length | 20mm |
| Width | 20mm |
XC3S50AN-4TQG144C Overview
Fpga chips is supplied in the 144-LQFP package. FPGAs of this type consist of FIELD PROGRAMMABLE GATE ARRAY components. A total of 108 I/Os are programmed to ensure a more coherent data transfer. 1.2V volts power it. The Field Programmable Gate Arrays family of FPGAs includes this part. The Surface Mount-slot connector on the FPGA module can be connected to the development board. Fpga chips operates at a voltage of 1.14V~1.26V and uses a battery to supply power. The Spartan?-3AN Series is one of the types of FPGAs that belong to this type. In order to ensure a safe and efficient operation, it is important to maintain a temperature within 0°C~85°C TJ at all times. With this device, you will be able to make use of 101 outputs. Using the Tray layout, this FPGA model can be contained in a very small amount of space. In total, there are a total of 144 terminations on fpga chips. There are 55296 RAM bits that are available with this device. Parts related to this part can be found using its base part number XC3S50AN. During the configuration of this FPGA module, the RAM si6.8kBe reaches 6.8kB to ensure that the program runs normally. Fpga electronics is designed wfpga electronics h 144 pins. 176 LABs and CLBs are built into this FPGA. In my opinion, this FPGA could produce fantastic results if mounted in Surface Mount, provided that its specifications are followed. The 1.2V supply voltage provides designers with full flexibility in their designs. An external power supply of 1.21.2/3.33.3V is required to power the device. Fpga semiconductor is made up of 50000 gates as fpga semiconductors basic building block. With a total of 144 pins, it is equipped with a high level of security. The architecture of the system is based on 176 CLBs. In order to deliver high efficiency, fpga semiconductor operates at a frequency of 667MHz. In this device, 1584 Macro cells are the main building blocks of a CPLD.
XC3S50AN-4TQG144C Features
108 I/Os
Up to 55296 RAM bits
144 LABs/CLBs
Operating from a frequency of 667MHz
XC3S50AN-4TQG144C Applications
There are a lot of Xilinx Inc. XC3S50AN-4TQG144C FPGAs applications.
- Bioinformatics
- Broadcast
- Data Mining
- Development Boards and Shields for Microcontrollers
- DO-254
- Aerospace and Defense
- ASIC prototyping
- Military Temperature
- Image processing
- Data center hardware accelerators
