XC7Z035-2FFV676E
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Package / Case | 676-BBGA, FCBGA |
| Supplier Device Package | 676-FCBGA (27x27) |
| Operating Temperature | 0°C~100°C TJ |
| Packaging | Bulk |
| Published | 2010 |
| Series | Zynq®-7000 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 4 (72 Hours) |
| Number of I/O | 130 |
| Speed | 800MHz |
| RAM Size | 256KB |
| Core Processor | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ |
| Peripherals | DMA |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Architecture | MCU, FPGA |
| Primary Attributes | Kintex™-7 FPGA, 275K Logic Cells |
| RoHS Status | ROHS3 Compliant |
This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).
This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).It has been assigned a package 676-BBGA, FCBGA by its manufacturer for this system on a chip.With 256KB RAM implemented, this SoC chip provides users with a high level of performance.As far as its internal architecture is concerned, this SoC design employs the MCU, FPGA technique.A system on chip SoC of this type belongs to the Zynq?-7000 series.This SoC meaning should have an average operating temperature of 0°C~100°C TJ.There is one thing to note about this SoC security: it combines Kintex?-7 FPGA, 275K Logic Cells.Featured in the state-of-the-art Bulk package, this SoC system on a chip provides outstanding performance.This SoC part contains a total of 130 I/Os in total.
Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
There are a lot of Xilinx Inc.
XC7Z035-2FFV676E System On Chip (SoC) applications.
- ARM
- High-end PLC
- Networked sensors
- Networked Media Encode/Decode
- Keywords
- Robotics
- Vending machines
- Fitness
- Central alarm system
- Sensor network-on-chip (sNoC)
