XC7Z045-2FFG900I
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Contact Plating | Copper, Silver, Tin |
| Package / Case | 900-BBGA, FCBGA |
| Surface Mount | YES |
| Operating Temperature | -40°C~100°C TJ |
| Packaging | Tray |
| Published | 2009 |
| Series | Zynq®-7000 |
| JESD-609 Code | e1 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 4 (72 Hours) |
| Number of Terminations | 900 |
| ECCN Code | 3A991.D |
| Terminal Finish | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) |
| HTS Code | 8542.39.00.01 |
| Technology | CMOS |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | 245 |
| Supply Voltage | 1V |
| Terminal Pitch | 1mm |
| Frequency | 800MHz |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Base Part Number | XC7Z045 |
| JESD-30 Code | S-PBGA-B900 |
| Operating Supply Voltage | 1V |
| Supply Voltage-Max (Vsup) | 1.05V |
| Interface | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB |
| Number of I/O | 130 |
| RAM Size | 256KB |
| Memory Type | ROMless |
| Core Processor | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ |
| Peripherals | DMA |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Architecture | MCU, FPGA |
| Data Bus Width | 32b |
| Core Architecture | ARM |
| Boundary Scan | YES |
| Speed Grade | -2 |
| RAM (words) | 256000 |
| Primary Attributes | Kintex™-7 FPGA, 350K Logic Cells |
| Bus Compatibility | CAN; ETHERNET; I2C; SPI; UART; USB |
| Height Seated (Max) | 3.35mm |
| Length | 31mm |
| Radiation Hardening | No |
| RoHS Status | ROHS3 Compliant |
This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).
A core processor Dual ARM? Cortex?-A9 MPCore? with CoreSight? is embedded in this SoC.Manufacturer assigns package 900-BBGA, FCBGA to this system on a chip.With 256KB RAM implemented, this SoC chip provides users with a high level of performance.A MCU, FPGA technique is used for the SoC design's internal architecture.Zynq?-7000 is the series name of this system on chip SoC.For this SoC meaning, the average operating temperature should be -40°C~100°C TJ.Taking note of the fact that this SoC security combines Kintex?-7 FPGA, 350K Logic Cells is important.There is a state-of-the-art Tray package that houses this SoC system on a chip.An integral part of this SoC consists of a total of 130 I/Os.A 1V power supply should be used.There is no safe voltage for the SoCs wireless above 1.05V.Having 900 terminations in total makes system on a chip possible.By searching XC7Z045, you will find system on chips with similar specs and purposes.In this wireless SoC, the frequency is set to 800MHz.There is no doubt that the SoC meaning is based on the core architecture of ARM.
Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM
There are a lot of Xilinx Inc.
XC7Z045-2FFG900I System On Chip (SoC) applications.
- Optical drive
- High-end PLC
- POS Terminals
- Smartphone accessories
- CNC control
- System-on-chip (SoC)
- Digital Media
- Temperature
- AC drive control module
- Automated sorting equipment
