XCV400-4BG560I
| Parameters | |
|---|---|
| Mount | Surface Mount |
| Mounting Type | Surface Mount |
| Package / Case | 560-LBGA Exposed Pad, Metal |
| Operating Temperature | -40°C~100°C TJ |
| Packaging | Tray |
| Published | 2000 |
| Series | Virtex® |
| JESD-609 Code | e0 |
| Pbfree Code | no |
| Part Status | Obsolete |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of Terminations | 560 |
| ECCN Code | 3A991.D |
| Terminal Finish | Tin/Lead (Sn63Pb37) |
| Subcategory | Field Programmable Gate Arrays |
| Technology | CMOS |
| Voltage - Supply | 2.375V~2.625V |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | 225 |
| Supply Voltage | 2.5V |
| Terminal Pitch | 1.27mm |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Base Part Number | XCV400 |
| Pin Count | 560 |
| JESD-30 Code | S-PBGA-B560 |
| Number of Outputs | 404 |
| Operating Supply Voltage | 2.5V |
| Number of I/O | 404 |
| RAM Size | 10kB |
| Clock Frequency | 250MHz |
| Number of Inputs | 404 |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY |
| Number of Logic Elements/Cells | 10800 |
| Total RAM Bits | 81920 |
| Number of Gates | 468252 |
| Number of LABs/CLBs | 2400 |
| Speed Grade | 4 |
| Combinatorial Delay of a CLB-Max | 0.8 ns |
| Height Seated (Max) | 1.7mm |
| Radiation Hardening | No |
| RoHS Status | Non-RoHS Compliant |
| Lead Free | Contains Lead |
XCV400-4BG560I Overview
The package that contains this software is called 560-LBGA Exposed Pad, Metal. Fpga chips consists of FIELD PROGRAMMABLE GATE ARRAY elements. Its 404 I/Os help it transfer data more efficiently. A fundamental building block consists of 10800 logic elements/cells. Power is provided by a 2.5V-volt supply. A Field Programmable Gate Arrays-series FPGA part. The Surface Mount-slot connector on the FPGA module can be connected to the development board. With a supply voltage of 2.375V~2.625V, this device operates with ease. It is a type of FPGA that belongs to the Virtex? series of FPGAs. In order to ensure a safe and efficient operation, it is important to maintain a temperature within -40°C~100°C TJ at all times. This device is equipped with 404 separate outputs, which makes it a very versatile device. There is an FPGA model contained in Tray in order to conserve space. 560 terminations are present in total. Fpga chips is important to note that this device has a RAM capacFpga chipsy of 81920 bFpga chipss. Its base part number XCV400 can be used to find parts that are related to it. For the program to work properly, the RAM si10kBe of this FPGA module must reach 10kB GB in order to ensure normal operation. The FPGA consists of 2400 LABs/CLBs. In order for this FPGA to work properly in accordance with its specifications, it is necessary that it is mounted in Surface Mount. Design engineers can fully take advantage of its flexibility when operating at 2.5V supply voltage. 468252 gates make up the basic block of its construction. The device has a total of 560 pins on fpga semiconductor. It usually uses a crystal oscillating at a frequency of 250MHz in order to do its work.
XCV400-4BG560I Features
404 I/Os
Up to 81920 RAM bits
XCV400-4BG560I Applications
There are a lot of Xilinx Inc. XCV400-4BG560I FPGAs applications.
- Military DSP
- Radar and Sensors
- Bioinformatics
- Defense Applications
- High Performance Computing
- Industrial IoT
- Enterprise networking
- ADAS
- Industrial Ethernet
- Scientific Instruments
