XCV812E-6BG560C
| Parameters | |
|---|---|
| Mount | Surface Mount |
| Mounting Type | Surface Mount |
| Package / Case | 560-LBGA Exposed Pad, Metal |
| Operating Temperature | 0°C~85°C TJ |
| Packaging | Tray |
| Published | 2002 |
| Series | Virtex®-E EM |
| JESD-609 Code | e0 |
| Pbfree Code | no |
| Part Status | Obsolete |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of Terminations | 560 |
| ECCN Code | 3A991.D |
| HTS Code | 8542.39.00.01 |
| Subcategory | Field Programmable Gate Arrays |
| Technology | CMOS |
| Voltage - Supply | 1.71V~1.89V |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | 225 |
| Supply Voltage | 1.8V |
| Terminal Pitch | 1.27mm |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Base Part Number | XCV812E |
| Pin Count | 560 |
| Number of Outputs | 404 |
| Operating Supply Voltage | 1.8V |
| Number of I/O | 404 |
| RAM Size | 140kB |
| Clock Frequency | 357MHz |
| Number of Inputs | 404 |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY |
| Number of Logic Elements/Cells | 21168 |
| Total RAM Bits | 1146880 |
| Number of Gates | 254016 |
| Number of LABs/CLBs | 4704 |
| Speed Grade | 6 |
| Combinatorial Delay of a CLB-Max | 0.47 ns |
| Height Seated (Max) | 1.7mm |
| Length | 42.5mm |
| Width | 42.5mm |
| Radiation Hardening | No |
| RoHS Status | Non-RoHS Compliant |
| Lead Free | Contains Lead |
XCV812E-6BG560C Overview
Fpga chips is supplied in the 560-LBGA Exposed Pad, Metal package. This kind of FPGA is composed of FIELD PROGRAMMABLE GATE ARRAY. This device features 404 I/Os in order to transfer data in a more efficient manner. To form a fundamental building block, there are 21168 logic elements/cells. Supply voltage is 1.8V volts. The Field Programmable Gate Arrays family of FPGA parts includes this part. By attaching the Surface Mount connector, you can use this FPGA module with your development board. The supply voltage of the device is 1.71V~1.89V , at which it runs. It is a type of FPGA belonging to the Virtex?-E EM seies. As far as the operating temperature is concerned, it should be kept within 0°C~85°C TJ when operating. With this device, you will be able to make use of 404 outputs. As a result of space limitations, this FPGA model has been included in Tray. Total terminations are 560. The RAM bits that this device offer is 1146880. Its base part number XCV812E can be used to find related parts. For the program to work properly, the RAM si140kBe of this FPGA module must reach 140kB GB in order to ensure normal operation. Fpga electronics contains 4704 LABs/CLBs in an array. In order for this FPGA to work properly in accordance with its specifications, it is necessary that it is mounted in Surface Mount. A 1.8V-volt supply allows designers to fully utilize its flexibility. The basic building block of this system consists of 254016 gates. There are a total of 560 pins on this device. It usually uses a crystal oscillating at a frequency of 357MHz in order to do its work.
XCV812E-6BG560C Features
404 I/Os
Up to 1146880 RAM bits
XCV812E-6BG560C Applications
There are a lot of Xilinx Inc. XCV812E-6BG560C FPGAs applications.
- Electronic Warfare
- Medical imaging
- Military Temperature
- Artificial intelligence (AI)
- Audio
- Medical Applications
- Solar Energy
- Radar and Sensors
- Digital signal processing
- Ecosystem
