XCV812E-7FG900C
| Parameters | |
|---|---|
| Mount | Surface Mount |
| Mounting Type | Surface Mount |
| Package / Case | 900-BBGA |
| Number of Pins | 900 |
| Operating Temperature | 0°C~85°C TJ |
| Packaging | Tray |
| Published | 1999 |
| Series | Virtex®-E EM |
| JESD-609 Code | e0 |
| Pbfree Code | no |
| Part Status | Obsolete |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of Terminations | 900 |
| ECCN Code | 3A991.D |
| HTS Code | 8542.39.00.01 |
| Subcategory | Field Programmable Gate Arrays |
| Technology | CMOS |
| Voltage - Supply | 1.71V~1.89V |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | 225 |
| Supply Voltage | 1.8V |
| Terminal Pitch | 1mm |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Base Part Number | XCV812E |
| Pin Count | 900 |
| Number of Outputs | 556 |
| Operating Supply Voltage | 1.8V |
| Number of I/O | 556 |
| RAM Size | 140kB |
| Clock Frequency | 400MHz |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY |
| Number of Logic Elements/Cells | 21168 |
| Total RAM Bits | 1146880 |
| Number of Gates | 254016 |
| Number of LABs/CLBs | 4704 |
| Speed Grade | 7 |
| Combinatorial Delay of a CLB-Max | 0.42 ns |
| Height Seated (Max) | 2.6mm |
| Length | 31mm |
| Width | 31mm |
| Radiation Hardening | No |
| RoHS Status | Non-RoHS Compliant |
| Lead Free | Contains Lead |
XCV812E-7FG900C Overview
As part of the 900-BBGA package, it is included. In this kind of FPGA, FIELD PROGRAMMABLE GATE ARRAY is used. Fpga chips is programmed wFpga chipsh 556 I/Os for transferring data in a more coherent manner. A fundamental building block contains 21168 logic elements or cells. The supply voltage is 1.8V volts. Field Programmable Gate Arrays family FPGA part. With a Surface Mount connector, this FPGA module can be attached to the development board. The supply voltage of the device is 1.71V~1.89V , at which it runs. FPGAs belonging to the Virtex?-E EM series are a type of FPGA that belong to the Virtex?-E EM series of FPGAs. Fpga chips is important to maintain the operating temperature wFpga chipshin the range of 0°C~85°C TJ when operating the machine. A total of 556 outputs are incorporated into this device. Unlike other FPGA models, this one is contained in Tray for the sake of space saving. 900 terminations are present in total. The RAM bits that this device offer is 1146880. In order to find related parts, use the part number XCV812E as a base. A significant amount of RAM is allocated to this FPGA module to ensure that the program can operate normally. The device has 900 pins which are included in the design. 4704 LABs/CLBs are configured on this FPGA. Providing that this FPGA is mounted in Surface Mount, it will be able to perform according to its specifications in a flawless manner. In the case of 1.8V supply voltage, designers can take full advantage of its flexibility. As a basic building block, fpga semiconductor consists of 254016 gates. In addition to this, it has 900 pins. Normally, fpga semiconductor uses an oscillator, which oscillates at 400MHz, to create the signal.
XCV812E-7FG900C Features
556 I/Os
Up to 1146880 RAM bits
900 LABs/CLBs
XCV812E-7FG900C Applications
There are a lot of Xilinx Inc. XCV812E-7FG900C FPGAs applications.
- Scientific Instruments
- Space Applications
- Medical Applications
- Industrial,Medical and Scientific Instruments
- Automotive
- Embedded Vision
- Enterprise networking
- DO-254
- Medical ultrasounds
- Industrial IoT
