XCZU11EG-1FFVC1760I
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Package / Case | 1760-BBGA, FCBGA |
| Operating Temperature | -40°C~100°C TJ |
| Packaging | Tray |
| Published | 2016 |
| Series | Zynq® UltraScale+™ MPSoC EG |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 4 (72 Hours) |
| HTS Code | 8542.31.00.01 |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| Number of I/O | 512 |
| Speed | 500MHz, 600MHz, 1.2GHz |
| RAM Size | 256KB |
| Core Processor | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
| Peripherals | DMA, WDT |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Architecture | MCU, FPGA |
| Primary Attributes | Zynq®UltraScale+™ FPGA, 653K+ Logic Cells |
| RoHS Status | ROHS3 Compliant |
This SoC is built on Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s).
Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s) are used in the construction of this SoC.Its package is 1760-BBGA, FCBGA.Users will enjoy reliable performance with this SoC chip, which has implemented 256KB RAM.This SoC design employs the MCU, FPGA technique for its internal architecture.Zynq? UltraScale+? MPSoC EG is the series number of this system on chip SoC.For this SoC meaning, the average operating temperature should be -40°C~100°C TJ.In addition, this SoC security combines Zynq?UltraScale+? FPGA, 653K+ Logic Cells.Tray package houses this SoC system on a chip.512 I/Os are included in this SoC part.
Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 processor.
256KB RAM.
Built on MCU, FPGA.
There are a lot of Xilinx Inc.
XCZU11EG-1FFVC1760I System On Chip (SoC) applications.
- Self-aware system-on-chip (SoC)
- Servo drive control module
- Central alarm system
- Published Paper
- Level
- Healthcare
- Digital Media
- System-on-chip (SoC)
- Wireless networking
- ARM support modules
