XCZU17EG-1FFVC1760E
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Package / Case | 1760-BBGA, FCBGA |
| Operating Temperature | 0°C~100°C TJ |
| Packaging | Tray |
| Published | 2016 |
| Series | Zynq® UltraScale+™ MPSoC EG |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 4 (72 Hours) |
| HTS Code | 8542.31.00.01 |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| Number of I/O | 512 |
| Speed | 500MHz, 600MHz, 1.2GHz |
| RAM Size | 256KB |
| Core Processor | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
| Peripherals | DMA, WDT |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Architecture | MCU, FPGA |
| Primary Attributes | Zynq®UltraScale+™ FPGA, 926K+ Logic Cells |
| RoHS Status | ROHS3 Compliant |
This SoC is built on Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s).
There are Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processors in this SoC.Package 1760-BBGA, FCBGA is assigned to this system on a chip by the manufacturer.As this SoC chip has 256KB RAM implemented, it provides reliable performance to its users.The internal architecture of this SoC design is based on the MCU, FPGA technique.Zynq? UltraScale+? MPSoC EG is the series name of this system on chip SoC.The average operating temps for this SoC meaning should be 0°C~100°C TJ.In addition, this SoC security combines Zynq?UltraScale+? FPGA, 926K+ Logic Cells.A state-of-the-art Tray package houses this SoC system on a chip.This SoC part contains a total of 512 I/Os in total.
Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 processor.
256KB RAM.
Built on MCU, FPGA.
There are a lot of Xilinx Inc.
XCZU17EG-1FFVC1760E System On Chip (SoC) applications.
- Functional safety for critical applications in the industrial sectors
- Transmitters
- Industrial transport
- Print Special Issue Flyer
- Automotive gateway
- Measurement tools
- Communication interfaces ( I2C, SPI )
- Smartphones
- ARM support modules
- Temperature Sensors
