XCZU17EG-L2FFVD1760E
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Package / Case | 1760-BBGA, FCBGA |
| Surface Mount | YES |
| Operating Temperature | 0°C~100°C TJ |
| Packaging | Tray |
| Published | 2016 |
| Series | Zynq® UltraScale+™ MPSoC EG |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 4 (72 Hours) |
| Additional Feature | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY |
| HTS Code | 8542.31.00.01 |
| Technology | CMOS |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Supply Voltage | 0.72V |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| JESD-30 Code | R-PBGA-B1760 |
| Supply Voltage-Max (Vsup) | 0.742V |
| Supply Voltage-Min (Vsup) | 0.698V |
| Number of I/O | 308 |
| Speed | 533MHz, 600MHz, 1.3GHz |
| RAM Size | 256KB |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT |
| Core Processor | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
| Peripherals | DMA, WDT |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Architecture | MCU, FPGA |
| Primary Attributes | Zynq®UltraScale+™ FPGA, 926K+ Logic Cells |
| RoHS Status | ROHS3 Compliant |
This SoC is built on Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s).
A core processor(s) Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 is integrated into this SoC.According to the manufacturer, this system on a chip has a package of 1760-BBGA, FCBGA.The SoC chip provides users with reliable performance because it is implemented with 256KB RAM.This SoC design employs the MCU, FPGA technique for its internal architecture.The system on a chip is part of the series Zynq? UltraScale+? MPSoC EG.Temperatures should be 0°C~100°C TJ on average for this SoC meaning.There is one thing to note about this SoC security: it combines Zynq?UltraScale+? FPGA, 926K+ Logic Cells.Housed in the state-of-art Tray package.In total, this SoC part has 308 I/Os.It is advised to utilize a 0.72V power supply.The SoCs wireless is considered unreliable if the voltage exceeds 0.742V.Power supplies of at least 0.698V are required.It uses MICROPROCESSOR CIRCUIT as a uPs/uCs/Peripheral SoC.Further features of this SoC processor are ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY.
Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 processor.
256KB RAM.
Built on MCU, FPGA.
MICROPROCESSOR CIRCUIT
ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY
There are a lot of Xilinx Inc.
XCZU17EG-L2FFVD1760E System On Chip (SoC) applications.
- Industrial AC-DC
- ARM Cortex M4 microcontroller
- Self-aware system-on-chip (SoC)
- Vending machines
- Networked Media Encode/Decode
- Flow Sensors
- Wireless sensor networks
- AC-input BLDC motor drive
- USB hard disk enclosure
- Networked sensors
