Parameters |
Factory Lead Time |
1 Week |
Package / Case |
1517-BBGA, FCBGA |
Operating Temperature |
-40°C~100°C TJ |
Packaging |
Tray |
Published |
2016 |
Series |
Zynq® UltraScale+™ MPSoC EG |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
4 (72 Hours) |
HTS Code |
8542.31.00.01 |
Peak Reflow Temperature (Cel) |
NOT SPECIFIED |
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED |
Number of I/O |
644 |
Speed |
500MHz, 600MHz, 1.2GHz |
RAM Size |
256KB |
Core Processor |
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
Peripherals |
DMA, WDT |
Connectivity |
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Architecture |
MCU, FPGA |
Primary Attributes |
Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells |
RoHS Status |
ROHS3 Compliant |
This SoC is built on Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s).
There are Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processors in this SoC.The manufacturer assigns this system on a chip with a 1517-BBGA, FCBGA package as per the manufacturer's specifications.The SoC chip provides users with reliable performance because it is implemented with 256KB RAM.The internal architecture of this SoC design is based on the MCU, FPGA technique.Zynq? UltraScale+? MPSoC EG is the series name of this system on chip SoC.This SoC meaning should have an average operating temperature of -40°C~100°C TJ when it is operating normally.There is one thing to note about this SoC security: it combines Zynq?UltraScale+? FPGA, 1143K+ Logic Cells.It is packaged in a state-of-the-art Tray package.This SoC part contains a total of 644 I/Os in total.
Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 processor.
256KB RAM.
Built on MCU, FPGA.
There are a lot of Xilinx Inc.
XCZU19EG-1FFVB1517I System On Chip (SoC) applications.
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