XCZU4EV-1FBVB900I
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Package / Case | 900-BBGA, FCBGA |
| Operating Temperature | -40°C~100°C TJ |
| Packaging | Tray |
| Published | 2016 |
| Series | Zynq® UltraScale+™ MPSoC EV |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 4 (72 Hours) |
| HTS Code | 8542.31.00.01 |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| Number of I/O | 204 |
| Speed | 500MHz, 600MHz, 1.2GHz |
| RAM Size | 256KB |
| Core Processor | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
| Peripherals | DMA, WDT |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Architecture | MCU, FPGA |
| Primary Attributes | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells |
| RoHS Status | ROHS3 Compliant |
This SoC is built on Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s).
This SoC is built on Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s).Its package is 900-BBGA, FCBGA.Users will enjoy reliable performance with this SoC chip, which has implemented 256KB RAM.This SoC design employs the MCU, FPGA technique for its internal architecture.Featured system on chip SoCs of the Zynq? UltraScale+? MPSoC EV series.It is expected that this SoC meaning will operate at -40°C~100°C TJ on average.One important thing to mark down is that this SoC meaning combines Zynq?UltraScale+? FPGA, 192K+ Logic Cells.In the state-of-the-art Tray package, this SoC system on a chip is housed.This SoC part contains a total of 204 I/Os in total.
Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 processor.
256KB RAM.
Built on MCU, FPGA.
There are a lot of Xilinx Inc.
XCZU4EV-1FBVB900I System On Chip (SoC) applications.
- Fitness
- Industrial transport
- Cyberphysical system-on-chip
- Networked sensors
- Smart appliances
- Vending machines
- Digital Signal Processing
- RISC-V
- Microcontroller
- Measurement testers
