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0440670801

Micro-Fit 3.0™ Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm Thick PCB, 8 Circuits, Tin (Sn) Plating


  • Manufacturer: Molex
  • Nocochips NO: 514-0440670801
  • Package: -
  • Datasheet: PDF
  • Stock: 720
  • Description: Micro-Fit 3.0™ Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm Thick PCB, 8 Circuits, Tin (Sn) Plating (Kg)

Details

Tags

Parameters
Factory Lead Time 1 Week
Contact Material Brass
Mount Through Hole
Mounting Type Through Hole
Contact Shape Square
Insulation Material Liquid Crystal Polymer (LCP), Glass Filled
Housing Material Thermoplastic
Packaging Tray
Series Micro-Fit 3.0 44067
JESD-609 Code e3
Feature Board Guide
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Kinked Pin, Solder
Connector Type Header
Max Operating Temperature 105°C
Min Operating Temperature -40°C
Applications General Purpose, Medical, Military, Telecommunications
Number of Rows 2
Voltage - Rated 250V
Fastening Type Locking Ramp
Contact Finish - Mating Tin
MIL Conformance NO
DIN Conformance NO
IEC Conformance NO
Filter Feature NO
Contact Type Male Pin
Mixed Contacts NO
Orientation Vertical
Terminal Pitch 3mm
Insulation Height 0.390 9.91mm
Style Board to Cable/Wire
Number of Positions Loaded All
Current Rating 5A
Pitch - Mating 0.118 3.00mm
Insulation Color Black
Row Spacing - Mating 0.118 (3.00mm)
Contact Length - Post 0.158 4.01mm
Shrouding Shrouded - 4 Wall
Number of Contacts 8
Halogen Free Low Halogen
Glow Wire Compliant Non-compliant
Contact Finish Thickness - Mating 100.0μin 2.54μm
Stack Height (Mating) 17.27mm
Material Flammability Rating UL94 V-0
RoHS Status ROHS3 Compliant
See Relate Datesheet

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