Parameters | |
---|---|
Factory Lead Time | 1 Week |
Contact Plating | Tin |
Material | FR4 Epoxy Glass |
Package Accepted | SOIC |
Published | 2011 |
Series | Correct-A-Chip® 350000 |
Size / Dimension | 0.800Lx0.460W 20.32mmx11.68mm |
JESD-609 Code | e0 |
Pbfree Code | no |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Termination | Solder |
ECCN Code | EAR99 |
Number of Positions | 8 |
Number of Rows | 2 |
Additional Feature | SOCKET ADAPTER |
Pitch | 0.050 1.27mm |
Reach Compliance Code | not_compliant |
Lead Pitch | 2.54mm |
Number of Contacts | 8 |
Device Socket Type | IC SOCKET |
Proto Board Type | SMD to DIP |
Height | 1.58mm |
Board Thickness | 0.062 1.57mm 1/16 |
RoHS Status | Non-RoHS Compliant |
Lead Free | Contains Lead |