08-350000-11-RC
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Contact Plating | Gold |
| Mount | Through Hole |
| Material | FR4 Epoxy Glass |
| Package Accepted | SOIC |
| Published | 2004 |
| Series | Correct-A-Chip® 350000 |
| Size / Dimension | 0.800Lx0.460W 20.32mmx11.68mm |
| Pbfree Code | yes |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Termination | Solder |
| ECCN Code | EAR99 |
| Number of Positions | 8 |
| Max Operating Temperature | 200°C |
| Number of Rows | 2 |
| Pitch | 0.050 1.27mm |
| Orientation | Straight |
| Depth | 11.68mm |
| Row Spacing | 7.62 mm |
| Proto Board Type | SMD to DIP |
| Height | 2.09mm |
| Board Thickness | 0.062 1.57mm 1/16 |
| REACH SVHC | No SVHC |
| RoHS Status | ROHS3 Compliant |
| Lead Free | Lead Free |
See Relate Datesheet
