09-0503-30
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Mount | Through Hole |
| Mounting Type | Through Hole |
| Housing Material | Polyamide (PA), Nylon, Glass Filled |
| Number of Positions or Pins (Grid) | 9 (1 x 9) |
| Contact Material - Mating | Beryllium Copper |
| Contact Material - Post | Brass |
| Packaging | Bulk |
| Published | 2003 |
| Series | 0503 |
| JESD-609 Code | e4 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Termination | Wire Wrap |
| Type | SIP |
| Number of Positions | 9 |
| Number of Rows | 1 |
| Contact Finish - Mating | Gold |
| Current Rating | 3A |
| Pitch - Mating | 0.100 2.54mm |
| Lead Pitch | 2.54mm |
| Number of Contacts | 9 |
| Contact Finish - Post | Tin |
| PCB Contact Pattern | RECTANGULAR |
| Lead Length | 12.7mm |
| Contact Style | RND PIN-SKT |
| Termination Post Length | 0.500 12.70mm |
| Pitch - Post | 0.100 2.54mm |
| Contact Finish Thickness - Mating | 30.0μin 0.76μm |
| Contact Finish Thickness - Post | 200.0μin 5.08μm |
| Material Flammability Rating | UL94 HB |
| RoHS Status | ROHS3 Compliant |
| Flammability Rating | UL94 HB |
See Relate Datesheet
