Parameters | |
---|---|
Factory Lead Time | 1 Week |
Contact Material | Copper |
Mount | Through Hole |
Mounting Type | Through Hole |
Housing Material | Thermoplastic, Glass Filled |
Number of Positions or Pins (Grid) | 13 (1 x 13) |
Contact Material - Mating | Beryllium Copper |
Contact Material - Post | Beryllium Copper |
Operating Temperature | -55°C~125°C |
Packaging | Tube |
Published | 2006 |
Series | Diplomate DL |
JESD-609 Code | e3 |
Feature | Closed Frame |
Pbfree Code | yes |
Part Status | Obsolete |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Termination | Solder |
ECCN Code | EAR99 |
Type | SIP |
Color | Black |
Number of Rows | 1 |
HTS Code | 8536.69.40.40 |
Contact Finish - Mating | Gold |
Orientation | Straight |
Pitch - Mating | 0.100 2.54mm |
Number of Contacts | 13 |
Contact Resistance | 30mOhm |
ELV | Compliant |
Termination Post Length | 0.130 3.30mm |
Pitch - Post | 0.100 2.54mm |
Contact Finish Thickness - Mating | 30.0μin 0.76μm |
Contact Finish Thickness - Post | 30.0μin 0.76μm |
Material Flammability Rating | UL94 V-0 |
Radiation Hardening | No |
RoHS Status | RoHS Compliant |
Flammability Rating | UL94 V-0 |