Parameters |
Factory Lead Time |
1 Week |
Contact Material |
Copper Alloy |
Mounting Type |
Surface Mount |
Material - Insulation |
Liquid Crystal Polymer (LCP) |
Operating Temperature |
-55°C~85°C |
Packaging |
Tray |
Series |
Sliver 2.0 |
Feature |
Board Guide, Pick and Place, Solder Retention |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
Not Applicable |
Termination |
Solder |
Connector Type |
CARD EDGE CONNECTOR |
Number of Positions |
280 |
Color |
Black |
Number of Rows |
2 |
Gender |
Female |
Pitch |
0.024 0.60mm |
Contact Finish |
Gold |
Card Type |
Non Specified - Dual Edge |
Read Out |
Dual |
Number of Positions/Bay/Row |
28; 28; 28; 28; 28 |
Contact Finish Thickness |
30.0μin 0.76μm |
Card Thickness |
0.062 1.57mm |
RoHS Status |
RoHS Compliant |
1-2328461-1 Overview
Material was packaged in accordance with Tray's specifications.The mount type Surface Mount is recommended.Using the connector socket CARD EDGE CONNECTOR is how the device is connected.Board Guide, Pick and Place, Solder Retention features are on this device.Sliver 2.0 indicates the series of the device.
1-2328461-1 Features
Sliver 2.0 series
1-2328461-1 Applications
There are a lot of TE Connectivity AMP Connectors 1-2328461-1 Edgeboard Connectors applications.
- Spectrum Analysis
- Data Acquisition Systems
- High Speed Data Acquisition for PCs
- Multicarrier, multimode digital receivers
- Communication Systems
- GSM, EDGE, PHS, UMTS, WCDMA, CDMA2000,
- Automotive
- Audio/Video devices
- Scientific instruments.
- Imaging Systems