Parameters | |
---|---|
Factory Lead Time | 1 Week |
Contact Plating | Tin |
Mount | Through Hole |
Mounting Type | Through Hole |
Package / Case | SOIC |
Number of Pins | 10 |
Contact Material - Post | Brass |
Board Material | Polyimide (PI) |
Published | 2005 |
Series | Correct-A-Chip® 350000 |
Feature | High Temperature |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Termination | Solder |
Number of Positions | 10 |
Contact Finish - Mating | Tin |
Pitch - Mating | 0.050 1.27mm |
Contact Finish - Post | Tin-Lead |
Lead Length | 3.175mm |
Termination Post Length | 0.125 3.18mm |
Pitch - Post | 0.100 2.54mm |
Convert From (Adapter End) | SOIC |
Convert To (Adapter End) | DIP, 0.3 (7.62mm) Row Spacing |
Contact Finish Thickness - Post | 200.0μin 5.08μm |
RoHS Status | Non-RoHS Compliant |