Parameters | |
---|---|
Contact Material | Copper |
Contact Plating | Gold |
Mount | Through Hole |
Mounting Type | Through Hole |
Number of Pins | 40 |
Housing Material | Polyphenylene Sulfide (PPS), Glass Filled |
Number of Positions or Pins (Grid) | 40 (2 x 20) |
Contact Material - Mating | Beryllium Copper |
Contact Material - Post | Brass |
Operating Temperature | -65°C~125°C |
Packaging | Bulk |
Published | 2012 |
Series | 100 |
Feature | Open Frame |
Part Status | Obsolete |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Termination | Solder |
Type | DIP, 0.6 (15.24mm) Row Spacing |
Number of Positions | 40 |
Contact Finish - Mating | Gold |
Current Rating (Amps) | 1A |
Pitch | 2.54mm |
Pitch - Mating | 0.100 2.54mm |
Number of Contacts | 40 |
Contact Finish - Post | Gold |
Termination Post Length | 0.126 3.20mm |
Pitch - Post | 0.100 2.54mm |
Height | 4.1mm |
Length | 50.8mm |
Width | 17.8mm |
Contact Finish Thickness - Mating | 8.00μin 0.203μm |
Contact Finish Thickness - Post | Flash |
Material Flammability Rating | UL94 V-0 |
RoHS Status | Non-RoHS Compliant |