10018783-00201TLF
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Contact Material | Copper Alloy |
| Contact Plating | GXT, Gold, Tin |
| Mount | Through Hole |
| Mounting Type | Through Hole |
| Housing Material | Nylon |
| Material - Insulation | Polyamide (PA), Nylon, Glass Filled |
| Operating Temperature | -55°C~85°C |
| Packaging | Tray |
| Feature | Board Guide, Locking Ramp |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Termination | Solder, Staggered |
| Number of Positions | 64 |
| Max Operating Temperature | 85°C |
| Min Operating Temperature | -55°C |
| Color | White |
| Number of Rows | 2 |
| Gender | Female |
| Pitch | 0.039 1.00mm |
| Orientation | Straight |
| Contact Finish | Gold or Gold, GXT™ |
| Housing Color | Natural |
| Card Type | PCI Express™ |
| Read Out | Dual |
| Max Voltage Rating (AC) | 300V |
| Contact Finish Thickness | 30.0μin 0.76μm |
| Card Thickness | 0.062 1.57mm |
| RoHS Status | RoHS Compliant |
10018783-00201TLF Overview
The material was packaged in accordance with Tray's specifications.The mounting type Through Hole is recommended.In terms of features, the device has Board Guide, Locking Ramp.This can be achieved by maintaining a maximum operating temperature of 85°C°C.The device must be kept at a temperature of -55°C degrees Celsius in order to be reliable.
10018783-00201TLF Features
10018783-00201TLF Applications
There are a lot of Amphenol ICC (FCI) 10018783-00201TLF Edgeboard Connectors applications.
- High Speed Data Acquisition for PCs
- Spectrum Analysis
- Communications
- GSM, EDGE, PHS, UMTS, WCDMA, CDMA2000,
- High Speed Data Acquisition
- Digital beam-forming systems for ultrasound
- Music reproduction technology
- Broadband data applications
- Multiplexed Data Acquisition Systems
- Scientific instruments
