10018783-10001TLF
| Parameters | |
|---|---|
| Mount | Through Hole |
| Mounting Type | Through Hole |
| Housing Material | Nylon |
| Material - Insulation | Polyamide (PA), Nylon, Glass Filled |
| Operating Temperature | -55°C~85°C |
| Packaging | Tray |
| Series | HPCE® |
| Feature | Board Guide, Locking Ramp |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Termination | Solder, Staggered |
| Connector Type | Cantilever |
| Number of Positions | 64 |
| Max Operating Temperature | 85°C |
| Min Operating Temperature | -55°C |
| Color | Black |
| Number of Rows | 2 |
| Gender | Female |
| Contact Type | Cantilever |
| Pitch | 0.039 1.00mm |
| Orientation | Straight |
| Current Rating | 1.1A |
| Contact Finish | Gold |
| Voltage - Rated AC | 300V |
| Number of Contacts | 64 |
| Housing Color | Black |
| Card Type | PCI Express™ |
| Read Out | Dual |
| Insulation Resistance | 1GOhm |
| Number of Positions/Bay/Row | 11; 21 |
| Max Voltage Rating (AC) | 300V |
| Length | 39mm |
| Width | 7.4mm |
| Contact Finish Thickness | 30.0μin 0.76μm |
| Card Thickness | 0.062 1.57mm |
| Board Thickness | 1.56mm |
| RoHS Status | RoHS Compliant |
| Flammability Rating | UL94 V-0 |
| Lead Free | Lead Free |
| Factory Lead Time | 1 Week |
| Contact Material | Copper Alloy |
| Contact Plating | Gold |
10018783-10001TLF Overview
As per Tray's specifications, the material was packaged.It's best to mount type Through Hole.Connecting the device is accomplished by using connector socket Cantilever.There are Board Guide, Locking Ramp features on this device.It's the series number HPCE?.Operating at a maximum temperature of 85°C°C ensures stable performance.Ensure that it works at a minimum temperature of -55°C degrees Celsius to ensure its reliability.
10018783-10001TLF Features
HPCE? series
10018783-10001TLF Applications
There are a lot of Amphenol ICC (FCI) 10018783-10001TLF Edgeboard Connectors applications.
- High Speed Data Acquisition
- Communications
- Smart antenna systems
- AC motor control
- Uninterrupted Power Supplies
- Handheld Terminal Interface
- Instrumentation and test equipment
- Battery Operated Systems
- Digital Storage Oscilloscope
- Digital beam-forming systems for ultrasound
