10018783-10012TLF
| Parameters | |
|---|---|
| Card Type | PCI Express™ |
| Read Out | Dual |
| Insulation Resistance | 1GOhm |
| Max Voltage Rating (AC) | 300V |
| Length | 56mm |
| Width | 7.4mm |
| Contact Finish Thickness | 30.0μin 0.76μm |
| Card Thickness | 0.062 1.57mm |
| Board Thickness | 2.36mm |
| RoHS Status | RoHS Compliant |
| Flammability Rating | UL94 V-0 |
| Lead Free | Lead Free |
| Factory Lead Time | 1 Week |
| Contact Material | Copper Alloy |
| Contact Plating | Gold |
| Mount | Through Hole |
| Mounting Type | Through Hole |
| Housing Material | Nylon |
| Material - Insulation | Polyamide (PA), Nylon, Glass Filled |
| Operating Temperature | -55°C~85°C |
| Packaging | Tray |
| Series | HPCE® |
| Feature | Board Guide, Locking Ramp |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Termination | Solder, Staggered |
| Connector Type | Cantilever |
| Number of Positions | 98 |
| Max Operating Temperature | 85°C |
| Min Operating Temperature | -55°C |
| Color | Black |
| Number of Rows | 2 |
| Gender | Female |
| Contact Type | Cantilever |
| Pitch | 0.039 1.00mm |
| Orientation | Straight |
| Current Rating | 1.1A |
| Contact Finish | Gold |
| Voltage - Rated AC | 300V |
| Number of Contacts | 98 |
| Housing Color | Black |
| Contact Resistance | 30mOhm |
10018783-10012TLF Overview
The material was packaged according to the specifications of Tray.It's recommended you mount it type Through Hole.As a method of connecting, the device uses the connector socket Cantilever.There are Board Guide, Locking Ramp features on this device.HPCE? indicates that the device belongs to the series.Operating temperatures of 85°C°C provide stable performance.It needs to work at a minimum of -55°C degrees Celsius.
10018783-10012TLF Features
HPCE? series
10018783-10012TLF Applications
There are a lot of Amphenol ICC (FCI) 10018783-10012TLF Edgeboard Connectors applications.
- Digital signal processing
- 4-channel data acquisition
- Digital Multimeters, PLC's (Programming Logic Controllers)
- CMOS Image sensors for mobile applications
- In-building wireless telephony
- AC motor control
- Instrumentation and test equipment
- Scientific instruments.
- Music reproduction technology
- Communication test equipment
