Parameters |
Factory Lead Time |
1 Week |
Contact Material |
Copper Alloy |
Contact Plating |
Gold |
Mounting Type |
Through Hole |
Material - Insulation |
Polyamide (PA), Nylon, Glass Filled |
Operating Temperature |
-55°C~85°C |
Packaging |
Tray |
Published |
2008 |
Series |
HPCE® |
Feature |
Board Guide, Locking Ramp |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
Termination |
Solder, Staggered |
Number of Positions |
64 |
Color |
Black |
Number of Rows |
2 |
Gender |
Female |
Contact Type |
Cantilever |
Pitch |
0.039 1.00mm |
Current Rating |
1.1A |
Contact Finish |
Gold |
Lead Pitch |
2.54mm |
Number of Contacts |
64 |
Housing Color |
Black |
Card Type |
PCI Express™ |
Read Out |
Dual |
Insulation Resistance |
1GOhm |
Number of Positions/Bay/Row |
11; 21 |
Contact Finish Thickness |
15.0μin 0.38μm |
Card Thickness |
0.062 1.57mm |
RoHS Status |
RoHS Compliant |
Lead Free |
Lead Free |
10018783-10101TLF Overview
We packaged the material in accordance with Tray's specifications.There is a recommendation for mounting type Through Hole.Feature-wise, the device has Board Guide, Locking Ramp.HPCE? means it's a series device.
10018783-10101TLF Features
HPCE? series
10018783-10101TLF Applications
There are a lot of Amphenol ICC (FCI) 10018783-10101TLF Edgeboard Connectors applications.
- Music reproduction technology
- Telecommunications
- Data Acquisition Systems
- GSM, EDGE, PHS, UMTS, WCDMA, CDMA2000,
- Communications
- Scientific instruments
- Rotary encoder
- Industrial Process Control
- Cell Phones
- Transducer