10018783-10111TLF
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Contact Material | Copper Alloy |
| Contact Plating | Gold |
| Mount | Through Hole |
| Mounting Type | Through Hole |
| Housing Material | Nylon |
| Material - Insulation | Polyamide (PA), Nylon, Glass Filled |
| Operating Temperature | -55°C~85°C |
| Packaging | Tray |
| Published | 2015 |
| Series | HPCE® |
| Feature | Board Guide, Locking Ramp |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Termination | Solder, Staggered |
| Connector Type | Cantilever |
| Number of Positions | 64 |
| Max Operating Temperature | 85°C |
| Min Operating Temperature | -55°C |
| Color | Black |
| Number of Rows | 2 |
| Gender | Female |
| Contact Type | Cantilever |
| Pitch | 0.039 1.00mm |
| Orientation | Straight |
| Current Rating | 1.1A |
| Contact Finish | Gold |
| Voltage - Rated AC | 300V |
| Number of Contacts | 64 |
| Housing Color | Black |
| Contact Resistance | 40mOhm |
| Card Type | PCI Express™ |
| Read Out | Dual |
| Insulation Resistance | 1GOhm |
| Number of Positions/Bay/Row | 11; 21 |
| Max Voltage Rating (AC) | 300V |
| Length | 39mm |
| Width | 7.4mm |
| Contact Finish Thickness | 15.0μin 0.38μm |
| Card Thickness | 0.062 1.57mm |
| Board Thickness | 2.36mm |
| RoHS Status | RoHS Compliant |
| Flammability Rating | UL94 V-0 |
| Lead Free | Lead Free |
10018783-10111TLF Overview
In accordance with Tray's specifications, the material was packaged.It's best to mount type Through Hole.This device is connected through the connector socket Cantilever.Features: Board Guide, Locking Ramp.A HPCE? means the device is a series device.For stable operation, keep it at 85°C°C.The device must maintain a minimum working temperature of -55°C degrees Celsius in order to ensure its reliability.
10018783-10111TLF Features
HPCE? series
10018783-10111TLF Applications
There are a lot of Amphenol ICC (FCI) 10018783-10111TLF Edgeboard Connectors applications.
- Communications
- Automotive
- Imaging Systems
- AC motor control
- Digital beam-forming systems for ultrasound
- Music reproduction technology
- Rotary encoder
- Digital signal processing
- Multiplexed Data Acquisition Systems
- High Speed Data Acquisition
